Wafer Marking with Precision
The unique identification of every single wafer is an essential part of modern semiconductor manufacturing. It ensures complete traceability across all production steps and thus makes a significant contribution to quality assurance and process control.
InnoLas supports the world’s leading chip and wafer manufacturers with high-precision, SEMI-compliant marking systems designed specifically for the demanding requirements of the semiconductor industry.
- SEMI-compliant
- Particle-free option
- All wafer sizes
Which process suits your wafers?
Our systems use advanced laser and galvo scanner technologies, which are indispensable for the two main processes in wafer marking (soft marking and hard marking).
Soft Marking (SML) – precise identification without compromise
For high-quality, polished wafers and EPI surfaces, soft marking is the ideal identification method. With a marking depth of only 0.5 to 5 micrometers, depending on the material, the sensitive wafer surface is subjected to minimal stress – without impairing the electrical or mechanical properties of the material. The particle-free marking result makes soft marking particularly suitable for cleanrooms and therefore the first choice for chip manufacturers who demand both the highest surface quality and complete traceability.
Marking depth
0.5 – 5 µm
Contamination
Particle-free
Process
Material melting
Ideal for:
Hard Marking (HML) – permanently readable on any surface
Rough, unpolished or mechanically stressed wafer surfaces require a robust identification method that remains reliably readable even under demanding conditions. With material removal of 5 to 100 micrometers, hard marking creates a deep, high-contrast mark that works flawlessly even on sawn, ground or etched surfaces. This makes hard marking the optimal solution for wafer manufacturers who need permanently stable, process-reliable identification along the entire value chain.
Material removal
5 – 100 µm
Contrast
High
Process
Material removal
Ideal for:
Lasers used
Our lasers, developed specifically for semiconductor marking, offer maximum stability even under demanding production conditions. With a maintenance-free service life of around 50,000 operating hours, they minimize downtime in wafer marking and sustainably reduce your operating costs. Thanks to state-of-the-art technology, the systems also stand out for their particularly low energy consumption.
Application
Developed for industrial use
Service life
50,000 hours
Operating costs
very low, as maintenance-free
Suitable for:
Supported materials and wafer sizes
Our wafer marking systems support a wide range of wafer materials:
Thanks to the wide choice of laser sources, a broad range of semiconductor materials and substrates can be marked precisely and particle-free, regardless of hardness or surface – from polished, sawn and etched wafers to EPI and coated substrates.
Wafers with diameters of 2″, 3″, 4″, 5″ and 6″ as well as 200 mm and 300 mm are supported. Square wafers of 310 x 310 mm can also be processed automatically.
The modular system design concept allows flexible adaptation, so that, for example, an integrated setup for 200 mm processing is optionally available on 300 mm systems.
Wafer Marking Systems
High-precision technology made in Germany – from entry-level to high-volume production systems.
IL 600
- Manual handling
- Wafer holder for various wafers
- Suitable for low volumes
IL 1000
- Automatic handling
- One load port
- Small footprint
IL 2000
- Automatic handling
- Four load ports
- Also configurable with sorting function
IL C2000
- Automatic handling
- Up to three load ports
- ISO 3 mini-environment
IL C3000
- Soft marking of polished wafers
- Suitable for AGV/OHT loading via E84
- ISO 3 mini-environment
IL 3000
- Hard marking of unpolished wafers
- Suitable for manual loading
- Four load ports
IL D3000
- Hard marking of unpolished wafers
- Suitable for AGV/OHT loading via E84
- Fan filter units optional
Consulting & Configuration
From the initial requirements analysis to the successful final acceptance of your wafer marking system, a dedicated contact person supports you – for a solution tailored exactly to your production requirements.
Global Sales Team
InnoLas wafer marking systems offer the highest precision, cleanroom compatibility and complete traceability for efficient, stable semiconductor processes.
Advantages – our systems deliver
Our customers are among the world’s leading manufacturers of wafers and semiconductor devices,
known as chips. They rely on InnoLas wafer markers because they can use them to ensure the following:
Complete traceability
Choose the optimal marking process based on your wafer material and your requirements.
Particle-free marking
Particle-free markings with defined depth, quality and SEMI-compliant fonts.
Universal material support
Flexible recipe control
Highest cleanliness
Seamless MES integration
Integrate systems seamlessly with the MES/host via SECS/GEM.
Increased productivity
Significantly increase throughput, quality and process stability.
Automatic quality verification during the process
High-resolution cameras check readability, contrast and marking position for complete quality assurance without manual effort.
Our platforms enable consistently controlled identification – a key building block for error-free line control, stable yield data and reliable MES traceability.
Marking Quality & Precision
All InnoLas wafer marking systems exceed the relevant SEMI specifications for wafer identification and marking:
Compliance with these standards ensures compatibility with commercially available readers and seamless integration into existing MES (Manufacturing Execution Systems). Codes can of course also be marked according to internal specifications – always with the highest precision.
Fully automatic quality verification during the process
High-resolution cameras check readability, contrast and marking position during wafer marking – automatically and in real time – for complete quality assurance without manual effort.
The result: every marking meets the highest requirements for precision, traceability and process reliability – even along complex, multi-stage production chains.
Integration and automation
Our wafer marking systems are designed for seamless integration into automated production lines. The Equipment Front End Module (EFEM) enables standardized connection to a fab’s automated material handling systems (AMHS) via the E84 SEMI standard.
A SECS II/GEM interface enables bidirectional data exchange with common MES systems for production control and quality control.
Maximum system availability & worldwide service
Our wafer marking systems feature durable, maintenance-free laser sources and optics that ensure uninterrupted marking operation and maximum process reliability. Fast access to maintenance modules and modern remote diagnostics enable early fault detection and preventive maintenance.
A service team available worldwide ensures fast support – on site or remotely. This minimizes downtime and maximizes equipment availability for demanding semiconductor applications.
