IL 3000
The IL 3000 is a powerful, automated wafer marking system available for industrial semiconductor manufacturing. The system was specifically developed for precise and reproducible Hard Laser Marking (HLM) of 300mm wafers and is particularly suitable for unpolished wafers.
The combination of powerful laser technology, precise wafer handling, and automated process flows enables reliable wafer identification – especially for high production volumes.
- Use for unpolished 300mm wafers (Hard Marking)
- Automated Handling & Alignment of Wafers
- Up to 4 Open Cassette Stations
- Many optional features configurable
Front side, back side, or both?
The base machine can be flexibly adapted to the individual wishes and requirements of our customers through a variety of optional features. For example, the machine marks the wafer either on the front side, the back side, or – in the same job – on both sides, always with the highest precision.
Highest Productivity & Throughput
For efficient production, the IL3000 features an automated handling system with a single-arm robot and double-end effector. Four cassette stations enable flexible loading and continuous material flow.
With a throughput of up to 125 wafers per hour – according to SEMI M12 & T7 specification, the IL 3000 is designed for applications with high demands on productivity and process stability.
