Wafer Marking

IL D3000

High-quality, high-speed Hard Laser Marking (HLM) of unpolished wafers is one of the ideal application areas for the IL D3000 platform. The wafers can be provided flexibly in open cassettes or FOUPs and automatically loaded onto the system via the SEMI E84 standard using AGV or OHT.

Customizability

Individually configurable – for the right wafer marker

With a wide range of optional features, the base machine can be expanded individually to meet our customers’ wishes and requirements. A sorting function is also available for the IL2000, allowing the system to be used as a wafer sorter.

Interior of the IL C2000 with laser and handling components
Laser marking on the wafer edge next to the notch
Cleanliness

Maximum cleanliness thanks to an ISO 3 mini-environment

With up to two SMIF stations, up to 50 wafers can be loaded onto the machine at the same time. A slight overpressure is always maintained in the process and transfer chamber, so the wafers are exposed exclusively to clean, filtered air.

SEMI M12 & T7 compliant
Up to 160 WPH
Marking accuracy approx. +/-100 µm
Hard marking
For high production volumes

The robot can be equipped with a single or dual arm, making the IL D3000 ideal for medium to high production volumes.

+49 8143 24195-0sales@il-semi.comDirectionsPersonal Support

Documents for the IL D3000

Enter your contact details and we will email you the product catalog and data sheet right away.

  • Product catalogPDF · 6.0 MB
  • Technical data sheet IL D3000PDF · 334.0 KB

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.