IL 600
The IL600 is the ideal entry-level solution for those requiring the highest marking quality without a high degree of automation. Featuring manual handling and a precise wafer chuck for alignment and centering, the system delivers the same outstanding marking quality as our larger InnoLas systems – compact, reliable, and cost-efficient. Perfect for research & development as well as lower production volumes where flexibility is a priority.
- Manual loading and unloading of the wafer
- A manual wafer chuck for wafer alignment
- Ideal for low production volumes and R&D
High-quality marking on many materials
Thanks to the variety of available laser beam sources, all common wafer materials in the semiconductor industry can be marked cleanly and particle-free. No compromises are made with the IL600 either, which is why only high-quality laser sources are used.
One chuck for wafers from 2" to 200 mm
The wafer chuck developed by InnoLas enables the processing of wafers ranging from 2″ to 200 mm, thanks to short changeover times of just a few minutes. Individual wafers are placed manually using vacuum tweezers.
After closing the wafer station, marking starts according to the stored marking recipe – either fully automatically or alternatively at the touch of a button.
