Wafer Marking

Wafer Marking

The InnoLas wafer marking systems are specially designed to mark semiconductor wafers with an individual code. This process serves to ensure the traceability of each individual wafer throughout the entire manufacturing process.
In order to always obtain a homogeneous and clean marking process on a wide variety of materials, we use a laser specially developed for marking on semiconductor materials. This, in combination with the optimal optical setup, guarantees high quality marking and also prevents any negative influence on subsequent processes.

A variety of fonts used in the semiconductor industry, such as SEMI OCR, SEMI T7 Data Matrix, Barcode 412 and “Engraved Mode” can be lasered onto the wafers in a recipe-controlled manner. Of course, the SEMI specifications applied for this purpose are taken into account. Excellent and reliable readability with commercially available reading systems is another feature of our marking processes, which are subject to continuous further development.


  • Application:        Individual ID marking on semiconductor wafer
  • Standards:        SEMI T5-0706 / SEMI M12-0706 / SEMI M13-0706 / SEMI T7-0303
  • Processes:       Deepmarking & debris free marking
  • Materials:          2” to 450mm semiconductor-, compound- and LED-Wafer
  • Surfaces:          Polished, lapped, ground, as-cut, etched, EPI and all other
  • Readability:       Excellent by human eye and camera system


  • Debris free
  • Depth: 0,5 – 5 µm
  • Diameter: 30 – 70 µm
  • Used for polished wafers


  • Local vaporization of the material
  • Depth: 5 – 150 µm
  • Diameter: 25 – 110 µm
  • Used for unpolished wafers


  • Marking through a dicing tape directly on the wafer
  • Softmarking & deepmarking possible
  • Used for wafers which a laminated on a dicing tape


  • Indiviual marking on each die/chip
  • Extreme fast marking time
  • Very high position accuracy