Together with the ISRA Vision Systems AG a fully automated wafer inspection system has been developed, assembled and commissioned. The automated wafer transfer between cassette and inspection tool and back is done by an InnoLas EFEM (Model: IL C3600). The inspection module incl. lightning, sensors, X/Y-table etc. is developed by the ISRA Vision.
With this system a 100% defect- and crack control of each die can be realised within a few seconds per wafer. If the system recognises a defect/crack (inside the wafer or on the surface) the affected die will be inked and removed by a pick & place robot. In this way the rejected amount of material can be reduced a lot which helps to increase the production yield dramatically.