Systems
Wafer Marking
Wafer Ø
mm
| 2" - 200 mm |
| 300 mm |
| 300/450 mm |
Wafer Sorting
OEM - Components
- Expands the beam of the laser from 2x up to 8x
- Positioning of the optics by accurate piezo engines
- Available for 355, 532 and 1064nm laser radiation
- Turns the wafer upside down
- Keeps the backside of the wafer clean
- Available for 150, 200 or 300mm wafers
- High accurate alignment and centering of the wafer
- Keeps backside of the wafer clean
- Available for 150, 200 or 300mm wafers
- Recognition of different cassettes by electro mechanical sensors
- Recognition of cassettes from 2 inch to 200mm
- Hard coated aluminum or ceramics end effectors for all wafer diameters
- Carbon edge grip end effectors for 150/200 or 300mm wafers