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Innolas-semiconductor-aligner-mit-wafer
15
Oct

Further product diversification

For many years we used edge grip components for 300mm wafers. From now on all of our machines can be equiped with optional edge grip handling for 150mm and 200mm wafer.

Next to the passive edge grip endeffector there is now also a edge grip flipper, a edge grip aligner and a active edge grip endeffector. Furthermore we now offer our patented intelligent endeffector which picks up the wafer centered. All components are now available for 150/200 and 300mm.